MOTOROLA has chosen China as its first wafer fabrication manufacturing base in the Asia Pacific, to capitalise on the country's soaring demand for semiconductors.
The United States technology group has just announced the next phase of its expansion plan, worth US$720 million, bringing its total investment in China to $1 billion.
Tam Chung-ding, senior vice-president of the group's Asia Pacific semiconductor product business, said the wafer fabrication project in Tianjin's Xiqing district would take up more than $500 million of the new investment.
Mr Tam said the balance was for expanding the production of cellular phones and pagers.
The plant will make eight-inch sub-micron wafers with a yearly production of 180,000 pieces, which can be used for car electronics, PC peripherals, telecommunications and digital electronic consumer products.
The wafer fabrication process will be supplied to Motorola's wholly owned assembly and testing plant in the Tianjin Technological and Economic Development Area.