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Universities boost ties with industry

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Eric Ng

Local universities are using the Hong Kong Productivity Council's (HKPC) connection with the business community to speed up commercialisation of their technology-research projects.

The Chinese University of Hong Kong (CUHK) yesterday signed a memorandum of understanding (MOU) with the HKPC to foster collaboration in downstream technological product development.

The two institutions will jointly establish a 'mobile computing and connectivity laboratory' to develop mobile-phone network applications covering sound, data and images.

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A consortium of 10 local companies will take part in the project.

Ching Pak-chung, Dean of the Engineering Faculty of CUHK, said the university was conducting six technology research projects involving investment of about $15 million.

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The projects are funded by the Industry Department's Industry Support Fund (ISF) set up in 1994 to foster technology innovation.

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