Centron Telecom, a mainland wireless telecommunications network firm, and die-cast components maker Ka Shui Holdings are aiming to raise a combined HK$1.3 billion in initial public offerings in Hong Kong this month, sources said.
Centron's deal, being arranged by JP Morgan, could raise as much as HK$1 billion. Ka Shui is eyeing HK$300 million in a deal sponsored by CIMB-GK, people familiar with the transactions said.
Fujian-based Centron, which gained approval from the Hong Kong stock exchange last week for the share sale, would start investor presentations next week, a source said.
The firm makes mobile-related products for wireless firms such as China Mobile and China Unicom and does network development and construction projects.
Ka Shui, a Hong Kong moulding company, planned to raise between HK$200 million and HK$300 million to fund the construction of a new plant at Daya Bay in Shenzhen, market sources said.
The firm has been meeting local investors since early this week and the public offering will be in place on June 12 to June 15. Trading is expected to start on June 27.