A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters
China chip maker Tsinghua Unigroup to default on US$450 million bond as concerns mount over debt levels on mainland
- Failure to repay principal could trigger cross-defaults on another US$2 billion in debt
- Chip maker previously defaulted on US$199 million debt in November
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A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters
