A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters
A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters

China chip maker Tsinghua Unigroup to default on US$450 million bond as concerns mount over debt levels on mainland

  • Failure to repay principal could trigger cross-defaults on another US$2 billion in debt
  • Chip maker previously defaulted on US$199 million debt in November

Topic |   Banking & Finance
A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters
A researcher works on a semiconductor chip at Tsinghua Unigroup’s research centre, in Beijing, China, in February 2016. Photo: Reuters
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