CHPT supplies total, high-quality vertical probe cards for semiconductor chip testing
- CHPT makes entire vertical probe cards and key components for applications such as memory, power management, and radio frequency integrated circuits
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Roughly 80 per cent of the world’s application processor (AP) chips in smartphones are tested using semiconductor testing products developed by leading Taiwanese company Chunghwa Precision Test Tech (CHPT).
Supplying to such a high-end global market, CHPT is advancing its technology to further serve today’s industries. Developing total solutions beyond AP chips, CHPT now makes entire vertical probe cards and key components for applications such as memory, power management, application-specific and radio frequency integrated circuits.
Working with top fabless companies and wafer makers worldwide, CHPT has been providing clients with high-quality and advanced vertical probe cards for semiconductor chip testing.
The test interface expert has perfected a complete in-house, one-stop strategy that allows it to respond quickly to technological and industry changes.
Its comprehensive research and development (R&D) environment stimulates customers and engineers to collaborate on next-generation technology. This flexible and diversified quality of service supports manufacturers launching the latest consumer electronics and mobile devices cost-effectively.
We are driven by pursuing the highest standards in quality, cost, technology, delivery and service
CHPT delivers comprehensive testing solutions to more than 300 technology firms worldwide. It engages with customers at least two years before a product’s launch, giving it a firmer grasp of its clients’ direction and testing requirements.
“We combined the semiconductor and satellite industries’ strengths to advance, and to do things differently from our peers,” says Scott Huang, president. “We are driven to pursue the highest standards in quality, cost, technology, delivery and service.”
A cut above other semiconductor testing providers, CHPT consolidates know-how from experts in the fields of mechanical, electrical, chemical and optical as it integrates its design and R&D capabilities with manufacturing, precise mechanism, and unparalleled after-sales services.
One of the company’s key products is the vertical probe card for wafer tests. Showcasing many of CHPT’s industry-leading technologies, the vertical probe card is a crucial test interface to save testing costs.
Consisting of the printed circuit board (PCB), interposer and probe head, CHPT’s vertical probe card features specifications that exceed industry standards and are suited for advanced processes.
As the only supplier in the market to make all of the vertical probe card’s key internal components, such as the needle, holder, interposer and the PCB, CHPT guarantees high-speed and good-quality signal transmissions.
Customers’ manufacturing time is shortened by at least one-third as a result, as clients can source all products from CHPT. The company’s high pin count of 40,000 also enables customers to test more wafers at any given time, leading to reduced testing costs.
“Our R&D prowess helped in building products that offer better simulations, cost structures and lead times for our customers,” Huang says. “We do not just look at the process, but we tailor-make machines to meet our own requirements.
“We invest up to 17 per cent of our revenue into R&D to fine-tune critical solutions and meet any manufacturing need. Since everything is done in-house, this gives us the edge over competitors.”
CHPT is open to working with universities and research partners while attracting highly skilled talent to foster more innovations. In the pipeline are the development of a more advanced probe head, a continuing satellite PCB project, and the creation of new solutions for a complete smart factory ecosystem.
“As we integrate the various engineering sectors – from mechanical, electrical, chemical to optical engineering – we dare to be different,” Huang says. “Responding to fast-paced industry changes, we help customers obtain test interfaces earlier to improve their market competitiveness.
“We are based in Taiwan, and we are building a new R&D operations headquarters while working with our subsidiaries in China, the US and Asia to serve customers. We want to fulfil their needs by providing advanced technology wherever they may be.”
