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China technology
EconomyChina Economy

China aims to plug gap between lab and market in hi-tech push with patent rule changes

  • Economic Daily commentary on Friday said China’s universities and research institutions need to expedite the issuance of high-value patents
  • Beijing is seeking new avenues of growth amid waning economic momentum and continued efforts to fend off an escalating tech war with the United States

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State-run Economic Daily said in an editorial commentary on Friday that China’s universities and research institutions need to expedite the issuance of high-value patents that align with present industrial demands. Photo: Xinhua
Mia Nurmamat
China is aiming to bridge a long-standing gap between scientific breakthroughs and market adoption by outlining detailed plans for converting patent applications, as it strives to mitigate Washington’s technological curbs while driving sustainable economic growth.

The state-run Economic Daily said in an editorial commentary on Friday that China’s universities and research institutions need to expedite the issuance of high-value patents that align with industrial demands.

“Universities and research institutes have faced a long-standing challenge with the low application rate of patents, both because they tend to produce abundant results with limited precision that can meet industrial needs, accompanied by inadequate channels for transforming patents into market-ready applications,” the report said.

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In China, researchers’ academic merits tend to be predominantly gauged by their publication output, impacting their motivation to delve into the commercialisation of their research findings, the report added.

This requires us to bring more scientific achievements from the laboratory to the market
Economic Daily commentary

The call came as Beijing grapples with enhancing the industrial utilisation of its hi-tech sector to provide a new avenue of growth amid waning economic momentum and continued efforts to fend off an escalating tech war with the United States.

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