Kulicke & Soffa propels next-generation devices with advanced packaging solutions
- Company’s end-to-end solutions range from thermo-compression bonding to flip-chip assembly and surface mount technology
Integrated device manufacturers spanning diverse industries will reap the benefits of breakthrough packaging technologies that enable miniaturisation and production efficiencies, thanks to hefty investments made by Kulicke & Soffa (K&S).
Renowned in the semiconductor industry for cutting-edge wire bonders, K&S has expanded through strategic acquisitions and research and development (R&D) intensity through the years. Today, its end-to-end solutions range from thermo-compression bonding to flip-chip assembly and surface mount technology.
“Our aggressive R&D investments, exceeding 14 per cent of revenue, allow K&S to be at the forefront of technology,” says Cheam Tong Liang, vice-president for corporate strategy.
K&S maintains eight R&D centres worldwide and five manufacturing facilities that are well-integrated into global supply chains. Strong after-sales support is provided across 18 offices globally.
Acquiring Assembléon in 2015, the company has increased its automotive industry exposure, strengthened its advanced packaging portfolio and entered the sizeable electronics assembly market. Likewise, in advanced packaging lithography, K&S is coming to market later this year with the world’s first dedicated stepper for next-generation integrated circuit assembly. Developed by Eindhoven-based Liteq, acquired by K&S in July 2017, the advanced lithography tool is differentiated for using a laser light source in enhancing the cost of ownership, throughput and imaging performance.
“This stepper can achieve about 1.5-micron accuracy, which makes it valuable for the next generation of advanced packaging,” Cheam says.
To support mini light-emitting diode (LED) technologies, K&S offers the most production-ready solution through PIXALUX, which delivers high throughput and accuracy for extremely small-die applications. Developed in partnership with United States-based Rohinni, PIXALUX is positioned to revolutionise high-performance automotive and larger-size or above 32-inch consumer electronic displays. The tool, which can place mini-LED die five times faster than conventional methods, is headed for broad market adoption.
K&S has also unveiled Katalyst, its single-platform flip-chip bonder suited for memory and microprocessor manufacturers.
“We have a clear competitive edge with Katalyst. It can handle die sizes between 1mm and 30mm and can deliver 15,000 units per hour at an accuracy of 3 microns,” Cheam says.
Influential across technological consortia in the US, Europe and Asia, K&S is keen on up-and-coming start-ups and local companies that offer high quality, reliability and cost-effective solutions. “New technologies are out there and if it’s the right fit for us, we will partner with them to bring new solutions to market,” Cheam says.
K&S will be present at this year’s SEMICON Taiwan and productronica Munich trade shows.