It was a small gift designed to inspire big dreams. The University of Chinese Academy of Sciences included samples of self-developed chips in an admission letter package sent to 400 undergraduate freshmen to encourage students to be more innovative and embrace the country’s goal of developing domestic high technologies.
A Loongson III chip was attached to an open letter to new students from university president Li Shushen, according to a post from the university’s public account on Chinese social media platform WeChat.