Tech war: fresh funding pipeline enables China’s sanctions-hit semiconductor industry to cope with latest US trade restrictions

  • The recently approved IPO plans of nine Chinese semiconductor firms are expected to raise a total of US$3 billion from investors
  • That comes hot on the heels of the go-ahead received by Hua Hong Semiconductor for its US$2.5 billion listing on Shanghai’s Star Market

Che Panin BeijingandAnn Caoin Shanghai
The IPO plans of nine Chinese semiconductor firms are expected to raise a total of US$3 billion from investors. Photo: Shutterstock
China’s sanctions-hit semiconductor industry is poised to receive a much-needed lifeline via capital raised from new public listings and mutual funds, according to the latest stock market filings and financing data, as Beijing doubles down on the country’s chip self-sufficiency drive amid tightened US trade restrictions.
The initial public offering (IPO) applications of nine entities in China’s semiconductor supply chain – including six integrated circuit (IC) design companies, a chip packaging firm, a wafer foundry and a packaging material provider – have been approved this month, according to domestic stock exchange filings. These IPOs are expected to raise a total of 21.6 billion yuan (US$3 billion) from investors.
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