A 300 millimetre silicon wafer, with 22 nanometre chips, in the semiconductor production clean rooms at the Globalfoundries fabrication plant in Dresden, Germany, on February 11, 2021. Photo: Bloomberg
A 300 millimetre silicon wafer, with 22 nanometre chips, in the semiconductor production clean rooms at the Globalfoundries fabrication plant in Dresden, Germany, on February 11, 2021. Photo: Bloomberg

China wants to boost disruptive semiconductor technologies as Moore’s Law moves towards its limit

  • Vice-Premier Liu He led science and technology officials in a meeting to discuss potential advanced technologies in the post-Moore Law era
  • China seeks to boost its domestic chip-making capability amid a protracted tech war with the US

A 300 millimetre silicon wafer, with 22 nanometre chips, in the semiconductor production clean rooms at the Globalfoundries fabrication plant in Dresden, Germany, on February 11, 2021. Photo: Bloomberg
A 300 millimetre silicon wafer, with 22 nanometre chips, in the semiconductor production clean rooms at the Globalfoundries fabrication plant in Dresden, Germany, on February 11, 2021. Photo: Bloomberg
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