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Semiconductors
Tech

BYD scraps spin-off of chip unit, citing new investment and restructuring to tap electric vehicle market

  • BYD said it had scrapped the plan because it is considering additional investment to ramp up capacity of a foundry project in Jinan
  • BYD said it will reconsider listing the semiconductor unit at a later date once the investment is complete

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New energy vehicles are seen at Xi’an plant of BYD Auto. Photo: Xinhua
Che Panin Beijing

Chinese electric vehicle maker BYD said its board of directors has terminated the spin-off and proposed initial public offering (IPO) of its semiconductor unit on the ChiNext board of the Shenzhen Stock Exchange, citing a restructuring plan.

Shenzhen-based BYD said it scrapped the plan because it is considering additional investments to ramp up the capacity of a foundry project in eastern China’s Shandong provincial capital of Jinan, to benefit from rising demand in the booming industry of electric vehicles (EV), according to an exchange filing late on Tuesday.

The new investment is expected to have an impact on the unit’s assets and business structure, according to the filing by China’s largest maker of batteries and electric cars.

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“BYD Semiconductor intends to seize the window to carry out large-scale wafer capacity investment and construction,” the company said in the filing.

Three in every five new vehicles entering China’s roads are expected to be powered by battery packs by 2030, according to a UBS forecast. Demand for vehicle-related chips had been buoyed by rising sales of new cars, which grew 113 per cent in the first nine months.
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