Huawei Technologies’ Kunpeng 920, a chip designed by subsidiary HiSilicon for data centres and cloud computing gear, is displayed during an unveiling ceremony at the company’s headquarters in Shenzhen in January of last year. Photo: AP Huawei Technologies’ Kunpeng 920, a chip designed by subsidiary HiSilicon for data centres and cloud computing gear, is displayed during an unveiling ceremony at the company’s headquarters in Shenzhen in January of last year. Photo: AP
Huawei Technologies’ Kunpeng 920, a chip designed by subsidiary HiSilicon for data centres and cloud computing gear, is displayed during an unveiling ceremony at the company’s headquarters in Shenzhen in January of last year. Photo: AP

Inside China Tech: chipping away at Huawei

  • A new US rule threatens to derail Huawei’s advanced semiconductor development efforts
  • It specifically targets the operations of chip design subsidiary HiSilicon

Topic |   China technology
Huawei Technologies’ Kunpeng 920, a chip designed by subsidiary HiSilicon for data centres and cloud computing gear, is displayed during an unveiling ceremony at the company’s headquarters in Shenzhen in January of last year. Photo: AP Huawei Technologies’ Kunpeng 920, a chip designed by subsidiary HiSilicon for data centres and cloud computing gear, is displayed during an unveiling ceremony at the company’s headquarters in Shenzhen in January of last year. Photo: AP
Huawei Technologies’ Kunpeng 920, a chip designed by subsidiary HiSilicon for data centres and cloud computing gear, is displayed during an unveiling ceremony at the company’s headquarters in Shenzhen in January of last year. Photo: AP
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