SMIC vice-chairman Chiang Shang-yi wants Chinese chip makers to focus on advanced packaging technologies. Photo: Handout SMIC vice-chairman Chiang Shang-yi wants Chinese chip makers to focus on advanced packaging technologies. Photo: Handout
SMIC vice-chairman Chiang Shang-yi wants Chinese chip makers to focus on advanced packaging technologies. Photo: Handout

SMIC urges China’s chipmakers to embrace advanced packaging as Moore’s Law slows nanometre node progress and US sanctions bite

  • The remarks could signal a shift in focus at the Shanghai foundry which has seen its chances of closing the tech gap with bigger rival TSMC hurt by US sanctions
  • Analysts said SMIC will need to combine IC packaging and wafer foundry expertise to remain competitive in the industry

Topic |   US sanctions on China
SMIC vice-chairman Chiang Shang-yi wants Chinese chip makers to focus on advanced packaging technologies. Photo: Handout SMIC vice-chairman Chiang Shang-yi wants Chinese chip makers to focus on advanced packaging technologies. Photo: Handout
SMIC vice-chairman Chiang Shang-yi wants Chinese chip makers to focus on advanced packaging technologies. Photo: Handout
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