Intel CEO Pat Gelsinger speaks during a press conference at a hotel in Kuala Lumpur, Malaysia, on December 16, 2021. Photo: AP
Intel CEO Pat Gelsinger speaks during a press conference at a hotel in Kuala Lumpur, Malaysia, on December 16, 2021. Photo: AP
Intel
Tech /  Big Tech

Intel plans US$7 billion chip plant in Malaysia, expanding presence in Asia amid semiconductor shortage

  • Intel is building new chip packaging facilities in Malaysia that are expected to begin production in 2024
  • The US-based semiconductor giant is looking to compete with TSMC in contract chip fabrication for other companies

Topic |   Intel
Bloomberg
Bloomberg

Updated: 4:04pm, 16 Dec, 2021

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Intel CEO Pat Gelsinger speaks during a press conference at a hotel in Kuala Lumpur, Malaysia, on December 16, 2021. Photo: AP
Intel CEO Pat Gelsinger speaks during a press conference at a hotel in Kuala Lumpur, Malaysia, on December 16, 2021. Photo: AP
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