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Xiaomi flexes chip prowess as new XRing O1 bests Apple’s A18 Pro in certain tests

The XRing O1’s launch marked the culmination of Xiaomi’s four-year-long journey to develop an advanced chip to rival those from Apple

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The XRing O1 marks a breakthrough for Xiaomi in advanced chip design after the firm made its mark in the electric vehicle and smartphone sectors. Photo: Handout
Ben Jiangin Beijing
Xiaomi on Thursday unveiled its new XRing O1 integrated circuit (IC) – designed to power the company’s next-generation smartphones and tablets – that it claims bested the performance of Apple’s latest A18 Pro chip in certain benchmark tests.
“I have confidence to say that the XRing O1 is very strong,” Xiaomi founder, chairman and chief executive Lei Jun said on Thursday at an event in Beijing, where the firm’s in-house-designed system-on-a-chip (SoC) was launched, alongside the 15S Pro smartphone and Pad 7 Ultra.

Lei attributed the XRing O1’s performance to its system architecture and production using an advanced 3-nanometre lithography process, which enabled Xiaomi to pack 19 billion transistors on the SoC – a chip density on par with Apple’s A18 series.

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The XRing O1 features a so-called 10-core design, in which an IC has 10 individual processing units – or cores – capable of executing instructions.

At Thursday’s event, Lei present data showing the XRing O1 matching Apple’s A18 Pro chip in single-core and multi-core tests, and surpassing the US-designed chip “by a large margin” in other benchmark tests.

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The XRing O1’s launch marked the culmination of Xiaomi’s four-year-long journey to develop an advanced SoC that delivers top-tier performance, using Apple’s A-series chips as its benchmark.

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