Wuhan-based Yangtze Memory Technologies Co, which successfully designed and manufactured China’s first 3D NAND flash memory in 2017, introduced in April its 128-layer, 1.33-terabyte X2-6070 chip. Photo: Handout Wuhan-based Yangtze Memory Technologies Co, which successfully designed and manufactured China’s first 3D NAND flash memory in 2017, introduced in April its 128-layer, 1.33-terabyte X2-6070 chip. Photo: Handout
Wuhan-based Yangtze Memory Technologies Co, which successfully designed and manufactured China’s first 3D NAND flash memory in 2017, introduced in April its 128-layer, 1.33-terabyte X2-6070 chip. Photo: Handout
Semiconductors

China’s top memory chip maker can’t wean itself off US for now

  • Yangtze Memory Technologies Co currently gets more than 80 per cent of its chip manufacturing equipment from the US and Japan
  • The company has said it will invest US$22 billion in a facility in Wuhan that is by far China’s most advanced factory for 3D NAND flash memory chips

Topic |   Semiconductors
Wuhan-based Yangtze Memory Technologies Co, which successfully designed and manufactured China’s first 3D NAND flash memory in 2017, introduced in April its 128-layer, 1.33-terabyte X2-6070 chip. Photo: Handout Wuhan-based Yangtze Memory Technologies Co, which successfully designed and manufactured China’s first 3D NAND flash memory in 2017, introduced in April its 128-layer, 1.33-terabyte X2-6070 chip. Photo: Handout
Wuhan-based Yangtze Memory Technologies Co, which successfully designed and manufactured China’s first 3D NAND flash memory in 2017, introduced in April its 128-layer, 1.33-terabyte X2-6070 chip. Photo: Handout
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