US President Joe Biden holds up a silicon wafer during the CEO Summit on Semiconductor and Supply Chain Resilience at the White House, April 12, 2021. Photo: AP
US President Joe Biden holds up a silicon wafer during the CEO Summit on Semiconductor and Supply Chain Resilience at the White House, April 12, 2021. Photo: AP

China bill with US$54 billion in chip funding faces uphill battle in Congress

  • A rare legislative foray into industrial policy, the bill included US$190 billion to strengthen US tech and an additional US$54 billion for chip production
  • Many issues addressed in the bill, including trade and human rights, are expected to feature at Monday’s virtual summit between Biden and Chinese leader Xi Jinping

US President Joe Biden holds up a silicon wafer during the CEO Summit on Semiconductor and Supply Chain Resilience at the White House, April 12, 2021. Photo: AP
US President Joe Biden holds up a silicon wafer during the CEO Summit on Semiconductor and Supply Chain Resilience at the White House, April 12, 2021. Photo: AP
READ FULL ARTICLE