Samsung Electronics president Roh Tae-moon, head of the company’s MX business for mobile devices, (left) met with Vietnamese Prime Minister Phạm Minh Chính on August 5, 2022. Photo: SCMP
Samsung Electronics president Roh Tae-moon, head of the company’s MX business for mobile devices, (left) met with Vietnamese Prime Minister Phạm Minh Chính on August 5, 2022. Photo: SCMP

Samsung to invest US$3.3 billion, produce new chip parts in Vietnam amid China’s concerns over US-led semiconductor alliance

  • Samsung president Roh Tae-moon discussed the new investment and other initiatives in Vietnam with Prime Minister Pham Minh Chinh last Friday
  • The firm is preparing trial production of its flip-chip ball grid array, used for semiconductor packaging, at its Samsung Electro-Mechanics complex

Samsung Electronics president Roh Tae-moon, head of the company’s MX business for mobile devices, (left) met with Vietnamese Prime Minister Phạm Minh Chính on August 5, 2022. Photo: SCMP
Samsung Electronics president Roh Tae-moon, head of the company’s MX business for mobile devices, (left) met with Vietnamese Prime Minister Phạm Minh Chính on August 5, 2022. Photo: SCMP
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