TSMC to open chip design centre in Munich, boosting Europe’s AI ambitions
TSMC is building the US$11 billion microchip manufacturing plant through a joint venture, European Semiconductor Manufacturing Company

President of TSMC Europe, Paul de Bot, said at the company’s 2025 Technology Symposium event that the Munich Design Centre would open during the third quarter of this year.
“It’s intended to support European customers in designing high-density, high-performance and energy-efficient chips with a focus on applications again in automotive, industrial, AI and [Internet-of-Things],” de Bot said.
Europe is currently formulating a strategy to catch up with the US and China on AI.

TSMC is building together with Infineon, NXP and Robert Bosch a new €10 billion (US$11.33 billion) microchip manufacturing plant in Dresden, Germany, through a joint venture called European Semiconductor Manufacturing Company (ESMC).