A 300 millimetre silicon wafer, with 22 nanometer chips, seen in the clean room at the GlobalFoundries fab in Dresden, Germany, on Feb. 11, 2021. Photo: Bloomberg A 300 millimetre silicon wafer, with 22 nanometer chips, seen in the clean room at the GlobalFoundries fab in Dresden, Germany, on Feb. 11, 2021. Photo: Bloomberg
A 300 millimetre silicon wafer, with 22 nanometer chips, seen in the clean room at the GlobalFoundries fab in Dresden, Germany, on Feb. 11, 2021. Photo: Bloomberg

US and China semiconductor working group unlikely to ease trade tensions in short term but seen as a good start, say analysts

  • The new working group serves as a communication channel for the two nations to find solutions in restricted trade of high-tech items like semiconductors
  • However, trade tensions in the semiconductor sector would not be eased any time soon amid US-China rivalry, say analysts

Topic |   US-China tech war
A 300 millimetre silicon wafer, with 22 nanometer chips, seen in the clean room at the GlobalFoundries fab in Dresden, Germany, on Feb. 11, 2021. Photo: Bloomberg A 300 millimetre silicon wafer, with 22 nanometer chips, seen in the clean room at the GlobalFoundries fab in Dresden, Germany, on Feb. 11, 2021. Photo: Bloomberg
A 300 millimetre silicon wafer, with 22 nanometer chips, seen in the clean room at the GlobalFoundries fab in Dresden, Germany, on Feb. 11, 2021. Photo: Bloomberg
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