Visitors look at a display of a semiconductor device at a trade fair for semiconductor technology, in Shanghai, China. Photo: Reuters Visitors look at a display of a semiconductor device at a trade fair for semiconductor technology, in Shanghai, China. Photo: Reuters
Visitors look at a display of a semiconductor device at a trade fair for semiconductor technology, in Shanghai, China. Photo: Reuters

US-China tech war: TSMC helps make breakthrough in semiconductor materials that could push back the ‘end’ of Moore’s Law

  • Using the semi-metal bismuth, researchers from TSMC, MIT, and NTU have shown a way to make chips smaller than 1nm
  • However, analysts say the breakthrough will not be ready for commercialisation for about a decade

Topic |   US-China tech war
Visitors look at a display of a semiconductor device at a trade fair for semiconductor technology, in Shanghai, China. Photo: Reuters Visitors look at a display of a semiconductor device at a trade fair for semiconductor technology, in Shanghai, China. Photo: Reuters
Visitors look at a display of a semiconductor device at a trade fair for semiconductor technology, in Shanghai, China. Photo: Reuters
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