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Semiconductors
TechTech War

Tech war: US, Taiwan, Japan gallop ahead in advanced semiconductors while China remains stuck at mature-node chips

  • TSMC founder Morris Chang said this week that an expansion to the more advanced 3-nm process was planned for the company’s Arizona site
  • China’s huge domestic market, especially lower-end segments served by legacy technology nodes, could provide a cushion for Chinese chip makers

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Taiwan Semiconductor Manufacturing Co (TSMC) headquarters in Hsinchu, Taiwan. Photo: Bloomberg
Che Panin Beijing

The chip technology gap between China and the West is likely to further widen as the US, Taiwan and Japan forge ahead with leading-edge projects while mainland Chinese foundries remain stuck at mature nodes due to US export controls, according to analysts.

The 5-nanometre Arizona plant developed by Taiwan Semiconductor Manufacturing Co (TSMC) is expected to hold an official opening ceremony next month and TSMC founder Morris Chang said this week that an expansion to the more advanced 3-nm process was planned for the Arizona site.

At home, TSMC’s next-generation 3-nm process is expected to begin mass production in Tainan, southern Taiwan, in the second half of this year.

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TSMC is developing the more sophisticated 2-nm process in Hsinchu, where its headquarters are located, while early stated 1-nm development is focused on a facility in Taoyuan, northern Taiwan.

A rendering of TSMC’s wafer fabrication facility in Arizona, which is scheduled to open in 2024. Photo: Handout
A rendering of TSMC’s wafer fabrication facility in Arizona, which is scheduled to open in 2024. Photo: Handout

Separately, eight Japanese heavyweights including Toyota Motor, Sony Group and telecoms giant NTT have formed a consortium to undertake 2-nm chip fabrication within the next five years, according to a report by Japanese public broadcaster NHK.

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