US-sanctioned Huawei denies breakthrough in chip packaging tech as speculation mounts on firm’s efforts to overcome trade restrictions
- Speculation has been rife about Huawei’s development of a new semiconductor packaging technology that can achieve 7-nanometre performance for chips
- Strict US trade restrictions have effectively cut Huawei’s access to advanced new integrated circuits for its smartphones and other devices
Shenzhen-based Huawei on Tuesday denied the rumours, which claimed that the new packaging tech was able to achieve 7-nanometre performance for chips, according to a report on Chinese media outlet Sina.com.
Semiconductors manufactured on 7-nm technology node have smaller transistors and perform faster with increased energy efficiency. These chips enable smartphones and other electronics devices to provide more features and consume less power.
Huawei declined to comment on Wednesday.
That conclusion was reached by Canada-based research firm TechInsights last year after inspecting a sample chip extracted from a cryptocurrency mining machine. SMIC, mainland China’s largest and most advanced contract chip maker, has not made any public comment about this finding.
The latest rumours about Huawei’s chip packaging breakthrough coincided with a surge in the share price of Chinese semiconductor firms on Tuesday.
Huawei had earlier applied for a patent on so-called extreme ultraviolet (EUV) lithography in May 2021, which was only made public by CNIPA late last year. Major chip makers use EUV lithography equipment, which employs laser technology to basically carve a pre-designed circuit onto a wafer, to produce advanced chips.