Japan starts subsidy scheme to revive domestic chipmaking, with US$3.46 billion going to TSMC and Sony
- Japanese government providing US$3.4 billion subsidy for construction of a TMSC/Sony plant that would produce thousands of semiconductors monthly
- Programme was introduced after global chip shortage affected numerous Japanese sectors

TSMC has collaborated with Sony Semiconductor Solutions Corp (SSS) to set up Japan Advanced Semiconductor Manufacturing Inc (JASM) and plans have been drawn up for a new fabrication plant in Kumamoto. Construction is scheduled to commence this year and the first 12-inch wafers are expected to roll off production lines in 2024. The plant will have a monthly capacity of 45,000 wafers.
The Japanese government is providing a subsidy of around Y400 billion (US$3.46 billion), equivalent to around half the total construction cost of the facility, with one of the strings attached to the deal a commitment for semiconductors to be produced at the plant for at least a decade.
The government’s contribution is the largest under the subsidy programme, which has been introduced after the weaknesses of global supply chains were made clear in recent years. Stresses on the delivery of microchips – and countless other components critical to modern industry – were particularly evident last year and caused problems for many sectors of Japanese business, but most notably the auto sector.
