China’s would-be chip darling Tsinghua Unigroup bedevilled by debt and bad bets

  • Unigroup has now either defaulted or had cross-defaults triggered on seven onshore and offshore bonds worth about US$3.6 billion
  • The state-backed conglomerate has warned it may not be able to make upcoming bond payments

A researcher plants a chip on an interface board at Tsinghua Unigroup’s research centre in Beijing. Photo: Reuters
Tsinghua Unigroup, a Chinese conglomerate that has long sought to become a semiconductor powerhouse, is now caught between a rock and a hard place, as debt woes mount while key chip units are failing to thrive, sources with knowledge of the matter said.
Best known for an unsuccessful US$23 billion bid for US chip maker Micron Technology in 2015, Unigroup in November shocked investors with a default on a 1.3 billion yuan (US$200 million) bond. Including that bond, Unigroup has now either defaulted or had cross-defaults triggered on seven onshore and offshore bonds worth about US$3.6 billion, according to Refinitiv data.
Print option is available for subscribers only.
SUBSCRIBE NOW
Copyright © 2025 South China Morning Post Publishers Ltd. All rights reserved.