Tsinghua Unigroup, a Chinese conglomerate that has long sought to become a
semiconductor powerhouse, is now caught between a rock and a hard place, as debt woes mount while key chip units are failing to thrive, sources with knowledge of the matter said.
Best known for an unsuccessful US$23 billion
bid for US chip maker Micron Technology in 2015, Unigroup in November shocked investors with a default on a 1.3 billion yuan (US$200 million) bond. Including that bond, Unigroup has now either defaulted or had cross-defaults triggered on seven onshore and offshore bonds worth about US$3.6 billion, according to Refinitiv data.